Indirect liquid cooling of a simulated computer processor using FC-72

Abstract

A heat sink was designed and built which removed 100 watts of heat from a simulated computer processor with dimensions similar to the Intel Pentium Il processor. Forced convection of the 3-M heat transfer fluid FC-72 was utilized and thermal plate temperatures were maintained below 70 degrees C. Boiling was verified visibly through a polycarbonate evaporator housing. The "chip" was simulated by a strip heater and the heat generated was conducted to an evaporator of our own design. The heat sink system consisted of an evaporator, pump, copper tubing and fittings and an air-cooled condenser. A rotameter, two pressure/vacuum gauges and seven thermocouples were used to monitor system parameters during testing.