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dc.contributor.authorJaskoviak, Dennisen_US
dc.date.accessioned2016-12-05T21:03:33Z
dc.date.available2016-12-05T21:03:33Z
dc.date.issued1999
dc.identifier.urihttp://commons.lib.niu.edu/handle/10843/17181
dc.description.abstractA heat sink was designed and built which removed 100 watts of heat from a simulated computer processor with dimensions similar to the Intel Pentium Il processor. Forced convection of the 3-M heat transfer fluid FC-72 was utilized and thermal plate temperatures were maintained below 70 degrees C. Boiling was verified visibly through a polycarbonate evaporator housing. The "chip" was simulated by a strip heater and the heat generated was conducted to an evaporator of our own design. The heat sink system consisted of an evaporator, pump, copper tubing and fittings and an air-cooled condenser. A rotameter, two pressure/vacuum gauges and seven thermocouples were used to monitor system parameters during testing.en_US
dc.format.extent104 pages (various pagings)en_US
dc.language.isoen_USen_US
dc.publisherNorthern Illinois Universityen_US
dc.rightsNIU theses are protected by copyright. They may be viewed from Huskie Commons for any purpose, but reproduction or distribution in any format is prohibited without the written permission of the authors.en_US
dc.subjectindirect liquid coolingen_US
dc.subjectcomputer processoren_US
dc.subjectFC-72en_US
dc.titleIndirect liquid cooling of a simulated computer processor using FC-72en_US
dc.type.genreDissertation/Thesisen_US
dc.typeTexten_US
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.description.degreeB.S. (Bachelor of Science)en_US


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